ÇòËÙÌåÓý

¿Í·þ
Ê×Ò³ / ²úÆ· / ¸ßËÙ»¥Á¬ / SI¸ßƵ²âÊÔ°å /
  • 2026Ììϱ­,×ãÇòÖ±²¥,NBAÖ±²¥,ÌåÓýÖ±²¥°É_ÇòËÙÌåÓý
  • 2026Ììϱ­,×ãÇòÖ±²¥,NBAÖ±²¥,ÌåÓýÖ±²¥°É_ÇòËÙÌåÓý
  • 2026Ììϱ­,×ãÇòÖ±²¥,NBAÖ±²¥,ÌåÓýÖ±²¥°É_ÇòËÙÌåÓý
  • 2026Ììϱ­,×ãÇòÖ±²¥,NBAÖ±²¥,ÌåÓýÖ±²¥°É_ÇòËÙÌåÓý

QSFP112 HOST COMPLIANCE BOARD

Compliant with IEEE802.3bj Specification
Compliant with IEEE802.3cd Specification
Compliant with IEEE 802.3ck Specification
Compliant with IEEE802.3bs Specification
OIF-CEI-112G-VSR-PAM4  
OIF-CEI-56G-VSR-NRZ Specification

·ÖÏíµ½£º

Part Details

Product Specification


ITEM

Description

Connector

Gold finger as defined in QSFP-DD112 MSA

Connector Contact

38-Pin hard-gold finger plug

Connector Configuration

N/A

Connector Termination Style

N/A

No. of HSIO Routed

4 TX and 4 RX

RF Co-axial Launch Connector

1.85mm Connector -50 Ohm

HSIO Routing

50 Ohm ¡À5% Single-Ended coplanar Microstrip

Board Stack-Up

6 Layers (1.00mm thickness)

De-embedding structure

2X THRU Line

Reference plane for 2X THRU 

De-embedding structure

40mils from void

Power source to DUT

N/A

ÕÒ²»µ½ÄúÏëÒªµÄ²úÆ·£¿£¿£¿ £¿£¿£¿£¿

  • 2026Ììϱ­,×ãÇòÖ±²¥,NBAÖ±²¥,ÌåÓýÖ±²¥°É_ÇòËÙÌåÓý
Ïà¹Ø²úÆ·
Ïà¹Ø²©¿Í
°×ƤÊé
½â¾ö¼Æ»®
¡¾ÍøÕ¾µØÍ¼¡¿¡¾sitemap¡¿